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Thermally Conductive Phase Change Materials | MU-C35
MU-C35

Item

Description

`Made in Taiwan Thermally Conductive Phase Change Materials`

Table of Contents

• Features

• Characteristic

• Information

• Application

• Can replace related products

• Pictures

Features

Sheet, easy to use, Good gap-filling ability low thermal resistance,100% solids MU-C35 thermal phase change material is based on a Hyper branch structure.

High-performance thermally conductive filler made of aluminum balls.

Thermal film can be as easy as cutting into various shapes, affixed to heat parts; give more than the phase change temperature, can be like Thermal Grease rule out of air, like filling in the tiny gap materials. Not recommended for use in insulating parts needed.

Characteristic:

• Interface between a power transistor, CPU or other heatgenerating component and a heatsink or rail
• Isolate electrical components and power sources from heat sink and/or mounting bracket
• Interface for discrete semiconductors requiring low pressure spring clamp mounting
• Consumer electronics
• Automotive systems
• Telecommunications
• Aerospace
• Military
• Medical devices
• Industrial

Information

Specification	SMIR	MU-C35	Method
Reinforcement Carrier		None
Filler Type		Metal
Color		4PBW	Visual
Thickness	mm	0.2	ASTM D374
Specific Gravity	g/cm3	%	ASTM D792
Thermal Impedance	°Cin2/W	0.019	ASTM D5470
Thermal Conductivity	W/mK	3.5	HOT DISK
Volume Resistivity	Ωcm	>10⁸	ASTM D257
Breakdown Voltage	KV	Non-Insulating	ASTM D149
Dielectric Constant	1	9/	ASTM D150
Application Temperature	°C	-20~130
Storage Temperature	°C	<23
Phase change	°C	48
Siloxane Volatiles D4~D20	%	0	41 362

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Thermally Conductive Phase Change Materials | MU-C35 MU-C35

Item

Description

Thermally Conductive Phase Change Materials | MU-C35
MU-C35